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IMAT Inc, Silicon Wafers, Thin Films, T ox, Thermal Oxide, Physical Vapor Deposition, Sputtering, Photoresist, Dry, Film, Bump Wafers, Wafer Processing - 50mm, 100mm, 200mm, 300mm, 324mm
IMAT Inc specializes in processing silicon wafers, including 100mm, 200mm, 300mm, 324mm, and 450mm, silicon wafer sputtering, dry film, BUMP, silicon wafer evaporation, silicon wafer thermal oxidation , silicon wafer patterning as well as silicon wafer sales.
Imatinc.com ~
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Thermal Conductive Bonding, Inc.
Thermal Conductive Bonding Inc leads the industry in Sputtering Target bonding, Indium Bonding, Elastomer Bonding and Molding, PVD (physical Vapor Deposition) Sputtering and other material bonding technologies. Contact us for contract manufacturing, engineering design services and free quotes. Locations in San Jose and Korea.
Tcbonding.com ~
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