Mems

Mems: 1,855 results found.

Used / Refurbished Wafer Processing and Automated Test Equipment Supplier
Leading Supplier of Refurbished/Used Equipment for Semiconductor, Opto, Mems, & Nano Industries Worldwide !
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ICSCRM 2011 | International Conference on Silicon Carbide and Related Materials
September 11 – 16, 2011, Cleveland, Ohio, USA. World’s premier technical conference series for microelectronics and MEMS technology based on silicon carbide.
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Junyan Zhang, 张俊彦,Lanzhou Institute of Chemical Physics
junyanzhang,ZhangJunyan,张俊彦,Lanzhou Institute of Chemical Physics,兰州化学物理研究所,super-lubrication,wear friction,Nanolubrication,超润滑,纳米摩?三价铬电镀,类金刚石,DLC,自主装,MEMS,摩擦磨损,zengzhixiang,曾志翔,junyanzhang
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Semiconductor Manufacturing
UniversityWafer.com provides researchers with wafers and other semiconductor related materials and services inexpensively and in a timely manner.
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Silicon Dioxide
University Research for researchers of chemistry, physics, materials, electrical engineering, MEMS and more.
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Beschleunigungsmesssysteme - Beschleunigungsaufnehmer
Die ALTHEN GmbH, Spezialist für das mechanische Messen physikalischer Größen, stellt ihnen auf dieser Seite Lösungen für die Sensorik, Sensortechnik und Messtechnik vor.
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http://www.innosensors.com
Innosensors provides miniaturized sensor solutions for the industrial and medical market.
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Ignacio Llamas Garro
Home Page
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IMAPS 2008 - 41st International Symposium on Microelectronics
The 41st International Symposium on Microelectronics. IMAPS 2008 is bringing together the entire microelectronics supply chain. IMAPS 2008 will feature industry-focused sessions on: Automotive, Biomedical, Telecom, Military Applications, and Consumer Electronics. Other sessions will include: Design and Modeling, Electrical Modeling and Design, Japanese/Chinese to English translated, Poster Sessions, Thermal Management, MEMS, 3D Packaging, Flip Chip, Wafer Level, Wirebonding, and many others. Keynote presentations will be given by the Honorable Donald L. Carcieri, Governor of Rhode Island, and Dr. John C. Zolper, Vice President, Raytheon Company. IMAPS 2008 will be held November 2-6, 2008, in Providence, Rhode Island.
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EV Group (EVG) 3D Interconnect - Bonder - Aligner - Coater
EV Group (EVG) 3D Interconnect, EVG GEMINI: the only field-proven automated production wafer bonder for 3D integration in the semiconductor industry designed for processing wafer sizes up to 300mm with maximum flexibility. Void-free bonding with sub-micron to micron-level alignment accuracy, Easy conversion to different wafer sizes, Modular design with a minimized footprint;
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