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Home | ThinMaterials AG
Thin Materials AG has developed for the semiconductor industry a carrier technology for ultra-thin wafers. Thin Materials´ technology allows to thin down wafers to 50 µm and less while the thinned wafer on carrier can be process “normal” wafer. The “Release Layer”, one of Thin Materials ´core technologies, allows the temporary wafer bonding and de-bonding afterwards. Wafers with or without high topography can be handled.
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