EV Group (EVG) 3D Interconnect - Bonder - Aligner - Coater EV Group (EVG) 3D Interconnect, EVG GEMINI: the only field-proven automated production wafer bonder for 3D integration in the semiconductor industry designed for processing wafer sizes up to 300mm with maximum flexibility. Void-free bonding with sub-micron to micron-level alignment accuracy, Easy conversion to different wafer sizes, Modular design with a minimized footprint; 3d-interconnect.com~Site InfoWhoisTrace RouteRBL Check Similar Sites: 3dinterconnect.com
EV Group (EVG) Wafer Bonding - Aligner - Coater - Bonder With over 500 single Bond Chambers and a total of more than 100 fully automated wafer bonding systems in the field of MEMS (Micro-Electro-Mechanical-Systems), 3D Integration, SOI (Silicon-on-insulator) and Thin Wafer Processing (Temporary Bonding and De-bonding Tools). EV Group is the uncontested worlds no.1 equipment supplier and process expert for wafer bonding. Wafer-bonder.com~Site InfoWhoisTrace RouteRBL Check Similar Sites: waferbonder.com