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ACF Anisotropic Conductive Film
ACF (or Anisotropic conductive film) is an epoxy system used by electronics industry to make electrical and mechanical connections from drive electronics to substrates. During ACF bonding, a combination of heat & pressure is applied on to chip (FPC/IC) for an appropriate time.
Conductives particles (each 3~5um) are compressed between IC and substrate (glass / PCB) while insulating materials pushed away.
This allows the compressed Ni-Au layer on the particles to conduct electricity between the IC and the substrates.
The epoxy cures and conductive particles are trapped into permanent compressed form.
The compressed particles are constantly pushing outwards to maintain good electrical conductivity under different environmental conditions.
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